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OLYMPUS BONDMASTER 600 MULTIMODE BOND TESTER SALE!!

Olympus, a world leader in nondestructive testing technologies, is pleased to announce the introduction of the new BondMaster 600 Bond Tester that is designed to nondestructively inspect bonds in honeycomb or laminate composites or metal-to-metal parts. This portable multimode adhesive bond testing instrument uses pitch-catch modes, mechanical impedance analysis (MIA), and resonance technologies to inspect materials that are commonly used in aerospace, energy, and automotive industries.
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The BondMaster 600 incorporates the latest advancements in high-performance bond testing technologies into one compact, durable unit with a vivid 5.7 inch full-screen VGA display capable of producing user-selectable, highly contrast signals in all lighting conditions.

The BondMaster 600 delivers a powerful combination of multiple mode bond testing software and highly advanced digital electronics, providing consistently crisp and high-quality signals. Whether you are inspecting honeycomb composite, metal-to-metal bonds, or laminate composite, the BondMaster 600 offers exceptional ease-of-use thanks to its direct-access keys and streamlined interface that features convenient presets for common applications. The enhanced user interface and simplified workflow of the BondMaster 600 offers archiving and reporting that are accessible to any level of user.

The resolution and brightness of the 5.7-inch VGA screen on the BondMaster 600 handheld bond tester becomes even more apparent when switched into full-screen mode. Activated by the simple touch of a key, the full-screen mode is always accessible regardless of the display mode or inspection method you are using. The BondMaster 600 bond tester is programmed for a range of standard inspection methods, including pitch-catch RF, pitch-catch impulse, pitch-catch swept, resonance, as well as a notably improved mechanical impedance analysis (MIA) method.

Key Features

  • Designed to meet the requirements of IP66.
  • Long battery life (up to 9 hours).
  • Compatible with existing BondMaster probes (PowerLink) and probes from other manufacturers.
  • Bright, 5.7-inch color VGA display.
  • Full-screen option in any display mode.
  • Intuitive interface with application-specific presets.
  • Instant display mode toggle using the RUN key.
  • New SCAN view (profile).
  • New SPECTRUM view and Frequency Tracking feature.
  • Direct-access key gain adjustment.
  • All-Settings configuration page screen.
  • Up to two real-time readings.
  • Storage capacity of up to 500 files (program and data).
  • On-board file preview

ApplicationRecommended Method
General Honeycomb Composites Skin-to-Core DisbondsPitch-Catch (RF or IMPULSE)
Honeycomb Composites Skin-to-Core Disbonds in Tapered Structures or Non-Constant GeometriesPitch-Catch (Swept)
Smaller Skin-to-Core Disbonds in Honeycomb CompositeMIA
Identification or Repaired Areas in Honeycomb CompositeMIA
General Detection of Delamination in CompositeResonance
Inspection of Metal-to-Metal BondsResonance

FeatureB600 (basic)B600M (multimode)
Frozen-Signals Calibration√√
Real-Time Readings√√
Application Selection√√
PowerLink Probe Support√√
Pitch-Catch RF and Impulse Modes√√
Pitch-Catch Swept√√
Mechanical Impedance Analysis (MIA) Mode

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Resonance Mode

√
(cable included)
Calibration Menu (Resonance and MIA Modes)

√
  • Availability: 10 In Stock
  • Model: OLYMPUS BONDMASTER 600 MULTIMODE BOND TESTER
  • Brand: OLYMPUS

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