NEW NDT SYSTEMS BONDASCOPE 3100 ULTRASONIC BOND TESTER SALE!!

The follow-on to the famed capability of the BondaScope 2100, the BondaScope 3100 re-defines the meaning of “Full Featured” and “Multi-Mode” Composite Bond Tester. The unit is housed in a larger, rugged aluminium case and features a high speed, 5.7” dia. QVGA, Hi-Bright, EL display featuring NDT Systems “X-or” Digital Phosphor, true persistence control.

In addition, the BondaScope 3100 incorporates all the features above including Resonance Impedance Plane Mode, adding an adjustable, Hi-Energy fixed frequency Mechanical Impedance Analysis Mode (MIA) as well as a Swept Frequency MIA (SweepMI) Mode bringing the MIA mode to a more useful and interpretive purpose. Specific to the BondaScope 3100 is the High-Energy, Swept Frequency Pitch-Catch Mode.

Multimode Operation:
The most common Pitch-catch (P/C) and Resonance modes are suited to laminates, bonded and sandwich structures. Pitch-catch is dry coupled, easy to use and works well on larger defects, >0.5". Resonance mode requires couplant but can identify smaller defects and even determine which layer the defect occurred in with multi-layered bonded structures.

Mechanical Impedance Analysis (MIA) mode is dry coupled and most suited to metal-to-metal bonding and stiffer skin to core constructions. It has less penetration but works well on irregular and curved surfaces and with the small tip can accurately position the location of the defect.

6 Inspection Methods:
When a probe is connected to the Bondascope 3100, the automatic recognition optimizes the settings for the probe type. There are 6 inspection methods available:

Pitch-Catch RF:
Transmits a short burst of acoustic energy to the part and measures the amplitude and phase change of the received signal directly. A disbond reduces sound attenuation into the part leading to a higher amplitude at the receiver.

Pitch-Catch Pulsed:
Transmits a spike pulse of broadband acoustic energy into the part and measures the amplitude of the received signal.

Pitch-Catch Swept:
Transmits a short burst of acoustic energy to the part across a pre-defined swept frequency range. The system measures the amplitude and phase change of the received signal.

MIA Fixed Frequency:
Probe tip driven at fixed frequency and the receiver, also coupled to the tip, measures the changes in probe loading across the part using amplitude and phase change. This is related to the stiffness of the bond.

MIA Swept Frequency:
Probe tip driven with a swept frequency and the receiver, also coupled to the tip, measures the changes in probe loading across the part using amplitude and phase change.

Resonance:
Probe driven at the resonance frequency and the damping caused by contact with the part is analysed. Defects are identified by a change in the phase and amplitude of the probe resonance caused by a change in acoustic impedance of the part.

Features:

• Resonance, Pitch-catch and Mechanical Impedance modes
• Programmable user setups
• Auto-Probe recognition and probe library
• RF Impedance plane display mode
• Time encoded bond profile display mode
• Reference display mode
• Alarm modes: Amplitude and Phase. Halo, square and ellipse ring gates
• Tone Burst, high energy pulsed mode and swept frequency mode
• Individually sizeable "ring" gates with alarms
• Compatible with probes from other manufacturers
• Splitcan and Splitview

Applications:

• Multi-layered laminates
• Skin to core flaws
• Glass fiber / carbon fiber composites
• Far-side defects
• Honeycomb and foam cores
• Impact damage
• Metal to metal bonding
• Adhesively bonded fittings
• Liquid Ingress

• Availability: 10 In Stock
• Model: NDT SYSTEMS BONDASCOPE 3100 ULTRASONIC BOND TESTER
• Brand: